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BERGQUIST Gap Filler Liquid Dispensed Materials

Two-Part Gap Filler

BERGQUIST  two-part, cure-in-place materials are dispensed as a liquid onto the target surface. As the components are assembled,the material will wet-out to the adjacent surfaces, filling even the smallest gaps and air voids. Once cured, the material remains a flexible and soft elastomer, designed to assist in relieving coefficient of thermal expansion (CTE) mismatch stresses during thermal cycling. Gap filler is ideally suited for applications where pads cannot perform adequately, can be used to replace grease or potting compounds, and is currently used in power supply, telecom, digital, and automotive applications.

Liquid Gap Filler Key Performance Benefits

Ultra-Low Modulus: Minimal Stress During Assembly Because gap filler is dispensed and wet-out in its liquid state, the material will create virtually zero stress on components during the assembly process. Gap filler can be used to interface even the most fragile and delicate devices.

Liquid Dispensable Gap Filler Thermal Conductivity Products:

BERGQUIST GAP FILLER TGF 1000 (GAP FILLER 1000)

BERGQUIST GAP FILLER TGF 1000SR (GAP FILLER 1000SR)

BERGQUIST GAP FILLER TGF 1100SF (GAP FILLER 1100SF)

BERGQUIST GAP FILLER TGF 1400SL (GAP FILLER 1400SL)

BERGQUIST GAP FILLER TGF 1500 (GAP FILLER 1500)

BERGQUIST GAP FILLER TGF 1500LVO (GAP FILLER 1500LV)

BERGQUIST GAP FILLER TGF 1500RW (LOCTITE TGF 1500RW)

BERGQUIST GAP FILLER TGF 2000 (GAP FILLER 2000)

BERGQUIST GAP FILLER TGF 3500LVO (GAP FILLER 3500LV)

BERGQUIST GAP FILLER TGF 3600 (GAP FILLER 3500S35)

BERGQUIST GAP FILLER TGF 4000 (GAP FILLER 4000)