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Company News

SIL PAD Thermally Conductive Insulators2022-02-14 11:04:35
SIL PAD Thermally Conductive Insulators

Q: What is the primary difference between BERGQUIST SIL PAD TSP A3000 (SIL PAD A2000)

and BERGQUIST SIL PAD TSP 3500(SIL PAD 2000) products?

A: BERGQUIST SIL PAD TSP A3000 (SIL PAD A2000) uses a different filler package than 

    BERGQUIST SIL PAD TSP 3500 (SIL PAD 2000). This change results in a more compliant 

    BERGQUIST SIL PAD TSP A3000 (SIL PAD A2000) material that inherently lowers interfacial resistance losses.

    This reduction in interfacial resistance results in improved overall thermal performance when measured at lower

    pressures in standard ASTM D5470 and TO-220 testing.


Q: Why are the thermal performance curves of BERGQUIST SIL PAD TSP 1800ST(BERGQUIST Sil-Pad 1800ST) and 

     BERGQUIST SIL PAD TSP 1100ST (BERGQUIST Sil-Pad 1100ST )so flat when compared to other SIL PAD materials?

A: SIL PAD TSP 1800ST(BERGQUIST Sil-Pad 1800ST) and BERGQUIST SIL PAD TSP 1100ST (BERGQUIST Sil-Pad 1100ST ) 

    wet-out the application surfaces at very low pressures. Optimal thermal performance is achieved at pressures as low as 50 psi.


Q: When should I choose BERGQUIST SIL PAD TSP 1680 (BERGQUIST SIL PAD 980)versus 

     BERGQUIST SIL PAD TSP 1600S (BERGQUIST SIL PAD 900S) for my  application?

A: BERGQUIST SIL PAD TSP 1680 (BERGQUIST SIL PAD 980) is specifically formulated to provide exceptional cut-through and crush resistance

    in combination with excellent heat transfer and dielectric properties. BERGQUIST SIL PAD TSP 1680 (BERGQUIST SIL PAD 980) has a proven

    history of reliability in high-pressure applications where surface imperfections such as burrs and dents are inherently common. 

    These applications often include heavily machined metal surfaces manufactured from extrusions or castings.  

    BERGQUIST SIL PAD TSP 1600S (BERGQUIST SIL PAD 900S) carries a high level of crush resistance and is more likely to be used in burr-free or

    controlled-surface finish applications.